| Material | Optical Grade | SAW Grade | Optical grade SLN CLN |
| Curie Temp | 1142±2.0℃
| 1142±0.7℃ |
| Cutting Angle | X/Y/Z etc | X/Y/Z/Y36/Y41/Y64/Y128/etc | X/Y/Z etc
|
| Diameter/size | 2”/3”/4” | 3”/4”/6"LN wafer & 8"under R/D
| 2”/3”/4” ±0.03mm |
| Tol(±) | <0.20 mm
| <0.20 mm ±0.005mm |
| Thickness | 0.18 ~ 0.5mm or more
|
Primary Flat
| 16mm/22mm /32mm /42.5mm /57.5mm |
TTV
| <3µm
|
| Bow | -30<bow<30
|
| Warp | <40µm
|
Orientation Flat
| All available
|
Surface Type
| Single Side Polished(SSP) /Double Sides Polished(DSP)
|
Polished side Ra
| <0.5nm
|
Back Side Criteria
| General is 0.2-0.5µm or as customized |
| S/D | 40/20 or 20/10
|
| Edge Criteria | R=0.2mm or Bullnose
| R=0.2mm C-type or Bullnose |
Optical doped
| Fe/Zn/MgO etc for optical grade LN< wafers
|
| Mg/Fe/Zn/MgO etc for optical grade LN< wafers per requested
|
Refractive index | No=2.2878/Ne=2.2033 @632nm wavelength | general:5.9x10-11<s<2.0*10-10 at 25℃ | No=2.2878/Ne=2.2033 @632nm wavelength/prism coupler method. |
Wafer Surface Criteria | Contamination | None
|
Particles ¢>0.3 µm
| <= 30 |
Scratch , Chipping
| None |
| Defect | No edge cracks, scratches, saw marks, stains |